Manufacturing Capabilities
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Minimum Track Width
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0.15mm
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Minimum Track Spacing
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0.15mm
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Minimum Track to Edge Clearance
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0.15mm
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Minimum Hole Position Tolerance
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+/-0.15mm
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Minimum PTH Hole Dia
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0.30mm
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Minimum Pad Dia
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0.40mm
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Minimum Annular Ring
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0.05mm
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Maximum Aspect Ratio PTH
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5
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Maximum Screen Printed Solder Window to Pad Edge
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0.05mm
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Hole Diameter Tolerence PTH Upto:
0.80 mm
0.81 TO 1.60 mm
1.61 TO 5.00 mm
non PTH:
1.60mm
1.61 mm to 5.00 mm
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+/-0.05mm
+/-0.05mm
+/-0.10mm
+/-0.05mm
+/-0.10mm
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Surface Finishes
- Solder Mask on Bare Copper (SMOBC) with hot air levelling
- Solder Mask on Bare Copper (SMOBC) with solderable lacquer
- Solder Mask on black oxide coating with hot air levelling
- Solder Mask on tin/lead fused tracks
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All these finishes can be given in:
- Liquid Photo imageable Solder Mask
- Liquid Screen Printed Solder Mask
- Dry Film Solder Mask
- Tin/Lead fused finish without Solder Mask
- Gold Plating over Nickel on Tabs and Pads
- Electrolytic Nickel plating on Tabs and Pads
- Carbon printing on Tabs or Fingers
- Peelable Solder Mask
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Specifications and Standards being followed:
1. IPC A600E, IPC SM 840C, IPC L 115B, IPC QE 605, IPC RB 276, IPC TM650
2. MIL 55110P, MIL STD 275, MIL P13949G, MIL STD 105P
3. BS 9760, 9762, 9763
4. IEC 326 & 249
5. IECQ C001001 & 001002
6. B.S. CECC 23000, B.S. 232000, B.S. SECC 23200 800
7. DGN 88D6
8. PREFAG IC & PREFAG 2D
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