Path to Future


Programme for the Future:

  1. Implement ISO 14001 by 2005 beginning.
  2. Obtain UL safety approval by July, 2004 for 4, 6 Layer PCBs.
  3. Introduce double sided testing with very fine line capacity by the end of 2004.
  4. Adopt 4/4 mil. technology by 2004.
  5. To start manufacturing of following product types by end 2004.
    1. Flexi-rigid PCBs.
    2. High Frequency & controlled impedance PCBs.
    3. Metal core PCBs.